Samsung is reportedly planning to introduce its latest memory products at the upcoming 2024 IEEE International Solid-State Circuit Conference.
The South Korean tech giant will be unveiling a new superfast DDR5 memory chip, in addition to its previously announced GDDR7 memory, which will be presented at the High-Density Memory and Interfaces session.
The high-capacity 32Gb DDR5 DRAM was developed using 12-nanometre (nm)-class process technology, providing twice the capacity of 16Gb DDR5 DRAM while maintaining the same package size.
Samsung will be unveiling its new DDR5 chip at an upcoming conference. While the details from Samsung are scarce, we do know that the DDR5 chip’s I/O speed can reach up to 8000Mbps per pin. It’s made using Samsung’s 5th generation 10nm class foundry node, specifically designed for DRAM products, and uses a Symmetric-Mosaic Architecture.
In late 2023, Samsung Electronics announced the release of a new DDR5 product.
SangJoon Hwang, the Executive Vice President of DRAM Product & Technology at Samsung Electronics, stated that their 12nm-class 32Gb DRAM technology would allow them to create DRAM modules of up to 1 terabyte (TB), which is ideal for meeting the growing need for high-capacity DRAM in the era of AI (Artificial Intelligence) and big data.
Samsung Electronics will continue to develop DRAM solutions using differentiated process and design technologies to push the boundaries of memory technology.
Samsung has developed a new DDR5 technology which allows for the production of 128GB DRAM modules without the Through Silicon Via (TSV) process. This is made possible by using 32Gb DRAM instead of the previous 16Gb DRAM, and it leads to a 10% reduction in power consumption. As data centres face increasing energy demands from AI, this solution is particularly welcome.
Samsung’s latest DDR5 technology supports DDR5-8000 speeds in single-rank configurations, and allows for 32GB and 48GB DIMMs, as well as 64GB and 96GB DIMMs in dual-rank configurations. More information on this new memory is expected to be revealed at the conference.